Abstract

In this paper we present an in depth design and simulation of MEMS based micro heater. Two .1µm thickness thin film platinum micro heaters (coated with  gold of .1µm thickness forming the bond pad) is fabricated on two separate 10µm thick silicon islands which again is fabricated on 2µm thick them oxide and the whole structure is fabricated on 400µm thick silicon substrate. The temperature coefficient of resistance (TCR) of the thin film platinum is 3.7x10 ^-3 /K. The average temperature of the micro heater is extracted using the determined TCR. The analysis shows that the operating temperature of  180⁰C  can be achieved with a power dissipitation of .4mW.